Defence Research And Development Organisation Tender
Repair Of Plc Automation Module And Hmi Of Wafer Surface Grinder System
- Opening DateFeb 25, 2025
- Closing DateMar 17, 2025
- Tender Amount Refer Document
Tender Overview
| Tender Title | Repair Of Plc Automation Module And Hmi Of Wafer Surface Grinder System | ||
| Tender ID | 2025_DRDO_698887_1 | Tender Reference Number | SSPL/MMG/SBM/B/R/24-25/084 |
| Tender Type | Single | ||
| Tender Opening Date | 2025-02-25 09:30 AM | Tender Closing Date | 2025-03-17 08:30 AM |
| Tender Value | Refer Document | Tender Location | Sspl, Delhi , North Delhi , Delhi |
| Tender Category | Services | Product Category | Electrical and Electronics Tenders, Machinery and Tools Tenders |
- Tender TitleRepair Of Plc Automation Module And Hmi Of Wafer Surface Grinder System
- Tender ID2025_DRDO_698887_1
- Tender Reference NumberSSPL/MMG/SBM/B/R/24-25/084
- Tender TypeSingle
- Tender Opening Date2025-02-25 09:30 AM
- Tender Closing Date2025-03-17 08:30 AM
- Tender Value Refer Document
- Tender LocationSspl, Delhi,North Delhi, Delhi
- Tender CategoryServices
- Product CategoryElectrical and Electronics Tenders, Machinery and Tools Tenders
Important Dates
| ePublished Date | 2025-02-24 11:30 AM | Bid Opening Date | 2025-03-18 09:00 AM |
| Document Download Start Date | 2025-02-24 12:00 PM | Document Download End Date | 2025-03-17 08:30 AM |
| Bid Submission Start Date | 2025-02-25 09:30 AM | Bid Submission End Date | 2025-03-17 08:30 AM |
| Clarification start Date | Clarification End Date | ||
| Bid Validity Period (in Days) | 90 |
- ePublished Date 2025-02-24 11:30 AM
- Bid Opening Date2025-03-18 09:00 AM
- Document Download Start Date2025-02-24 12:00 PM
- Document Download End Date2025-03-17 08:30 AM
- Clarification End Date
- Clarification End Date
- Bid Submission Start Date2025-02-25 09:30 AM
- Bid Validity Period (in Days)90
Cost Specification
| Tender Fee | Refer document |
| EMD (Earnest Money Deposit) | ₹ 12,461 |
| EMD Fee Type | Fixed |
| Payment Instruments/Mode | Offline |
Tender Description
Work Description - Repair Of Plc Automation Module And Hmi Of Wafer Surface Grinder System
The Department of Defence Research and Development (DRDO), SSPL, invites tenders for the repair of the PLC Automation Module and HMI of a Wafer Surface Grinder System (Tender Reference Number: SSPL/MMG/SBM/B/R/24-25/084; Tender ID: 2025_DRDO_698887_1). This single-tender, service-based contract requires the submission of both technical and financial proposals (refer to RFP2425084.pdf for details). The tender document is available for download from February 24th, 2025, 05:30 PM to March 17th, 2025, 02:00 PM. Bids must be submitted online by March 17th, 2025, 02:00 PM, with opening scheduled for March 18th, 2025, 02:30 PM at SSPL (ONLINE). A fixed EMD of ₹12,461 is payable to the DIRECTOR, SSPL in DELHI; exemption or use of a Bank Guarantee/ST is permitted. The work is to be completed within 45 days. Interested parties should contact Sunil Kumar Singh, Sr. Stores Officer-II, DRDO, SSPL, Lucknow Road, Timarpur, Delhi, India, 110054 for further inquiries.
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Tender Contact Details
| Office Inviting Bids | Sunil Kumar Singh, Sr. Stores Officer-ii |
| Address | Drdo, Sspl, Lucknow Road, Timarpur, Delhi, India |
| Contact Details | NA |
| NA | |
| Website | NA |
Documents
- Tender document will be available to download after 2025-02-24 12:00 PM. Please check authority website for further updates.
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