University Of Delhi Tender

Work Description - Semiconductor Wafer I.e. Gan/algan Hemt Structure On 4-inch Diameter Sic

The Delhi University, Department of Electronic Science, invites sealed bids for the supply of Semiconductor Wafers (GaN/AlGaN HEMT Structure on 4-inch diameter SiC), Tender ID 2025_DU_849062_1, Reference Number DOES/SDRL/SERB-DST/01. This open tender, with a tender value of ₹12,00,000, requires two covers: a technical bid (including tender fee of ₹500) and a financial bid (BoQ). The EMD is ₹24,000 (2% of tender value), payable to the Director, University of Delhi South Campus, with BG/ST or exemption allowed. Bid submission opens February 15th, 2025, at 6:00 PM and closes March 12th, 2025, at 2:00 PM. Bid opening is March 13th, 2025, at 2:00 PM at the University of Delhi South Campus, New Delhi 110021. Interested bidders should contact the Principal Investigator at the Department of Electronic Science, University of Delhi South Campus, New Delhi 110021 for further details. The bid validity period is 90 days. Payment is offline via Demand Draft.