Indian Institute Of Technology Tender

Goods
Electronics Equipment
+ 1
Machinery and Tools

Tender For Supply And Installation Of Wire Bonder

  • Opening DateFeb 14, 2025
  • Closing DateFeb 27, 2025
  • Tender Amount Refer Document

Tender Overview

Tender Title Tender For Supply And Installation Of Wire Bonder
Tender ID2025_IITRP_843875_2Tender Reference Number1998-24
Tender TypeOpen Tender
Tender Opening Date2025-02-14 10:30 AMTender Closing Date2025-02-27 09:30 AM
Tender Value Refer Document Tender LocationIit Ropar , Ropar , Punjab
Tender CategoryGoodsProduct CategoryElectronics Equipment Tenders, Machinery and Tools Tenders
Tender Overview
  • Tender TitleTender For Supply And Installation Of Wire Bonder
  • Tender ID2025_IITRP_843875_2
  • Tender Reference Number1998-24
  • Tender TypeOpen Tender
  • Tender Opening Date2025-02-14 10:30 AM
  • Tender Closing Date2025-02-27 09:30 AM
  • Tender Value Refer Document
  • Tender LocationIit Ropar,Ropar, Punjab
  • Tender CategoryGoods
  • Product CategoryElectronics Equipment Tenders, Machinery and Tools Tenders

Important Dates

ePublished Date 2025-02-14 10:30 AM Bid Opening Date2025-02-27 10:00 AM
Document Download Start Date2025-02-14 10:30 AMDocument Download End Date2025-02-27 09:30 AM
Bid Submission Start Date2025-02-14 10:30 AMBid Submission End Date2025-02-27 09:30 AM
Clarification start Date2025-02-14 10:30 AMClarification End Date2025-02-21 05:30 AM
Bid Validity Period (in Days)180
Important Dates
  • ePublished Date 2025-02-14 10:30 AM
  • Bid Opening Date2025-02-27 10:00 AM
  • Document Download Start Date2025-02-14 10:30 AM
  • Document Download End Date2025-02-27 09:30 AM
  • Clarification End Date2025-02-14 10:30 AM
  • Clarification End Date2025-02-21 05:30 AM
  • Bid Submission Start Date2025-02-14 10:30 AM
  • Bid Validity Period (in Days)180

Cost Specification

Tender Fee Refer document
EMD (Earnest Money Deposit) ₹ 96,000
EMD Fee Type Fixed
Payment Instruments/Mode Offline

Tender Description

Work Description - Tender For Supply And Installation Of Wire Bonder

The Indian Institute of Technology Ropar (IIT Ropar) invites sealed tenders for the supply and installation of a Wire Bonder (Tender ID: 2025_IITRP_843875_2, Tender Reference Number: 1998-24). This open tender, with a bid submission deadline of February 27th, 2025, at 3:00 PM, requires a fixed EMD of ₹96,000 payable to the IIT Ropar Revenue Account in Ropar. Tender documents are available for download from February 14th, 2025, at 4:00 PM until February 27th, 2025, at 3:00 PM. Bids will be opened on February 27th, 2025, at 3:30 PM at the M Visvesvaraya Block, IIT Ropar. The tender is categorized under "Goods," specifically "Laboratory and scientific equipment," and further details, including technical specifications and the BOQ, are available in the tender documents. Interested bidders should submit two covers – one for technical and pre-qualification aspects (PDF) and another for financial details (XLS). The successful bidder will have 45 days to complete the work and the bid validity period is 180 days. Contact the Assistant Registrar, Store and Purchase Section, M Visvesvaraya Block, IIT Ropar, Rupnagar 140001 for further inquiries.

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Tender Contact Details

Office Inviting Bids Assistant Registrar
AddressStore And Purchase Section M Visvesvaraya Block Indian Institute Of Technology Ropar Rupnagar 140001
Contact Details NA
Email NA
Website NA

Documents

  • Document Not Available

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