Defence Research And Development Organisation Tender
Backend Design,physical Ip,fabrication,packaging And Supply Of Multi Processor System On Chips
- Opening DateMar 05, 2025
- Closing DateMar 24, 2025
- Tender Amount Refer Document
Tender Overview
| Tender Title | Backend Design,physical Ip,fabrication,packaging And Supply Of Multi Processor System On Chips | ||
| Tender ID | 2025_DRDO_700325_1 | Tender Reference Number | RCI/25ATT144/CMS-II |
| Tender Type | Open Tender | ||
| Tender Opening Date | 2025-03-05 12:30 PM | Tender Closing Date | 2025-03-24 04:30 AM |
| Tender Value | Refer Document | Tender Location | Conference Hall,dcmm,rci , Rangareddy , Telangana |
| Tender Category | Goods | Product Category | Electronics Equipment Tenders, Software and IT Solutions Tenders |
- Tender TitleBackend Design,physical Ip,fabrication,packaging And Supply Of Multi Processor System On Chips
- Tender ID2025_DRDO_700325_1
- Tender Reference NumberRCI/25ATT144/CMS-II
- Tender TypeOpen Tender
- Tender Opening Date2025-03-05 12:30 PM
- Tender Closing Date2025-03-24 04:30 AM
- Tender Value Refer Document
- Tender LocationConference Hall,dcmm,rci,Rangareddy, Telangana
- Tender CategoryGoods
- Product CategoryElectronics Equipment Tenders, Software and IT Solutions Tenders
Important Dates
| ePublished Date | 2025-03-05 12:30 PM | Bid Opening Date | 2025-03-25 05:00 AM |
| Document Download Start Date | 2025-03-05 12:30 PM | Document Download End Date | 2025-03-24 04:30 AM |
| Bid Submission Start Date | 2025-03-05 12:30 PM | Bid Submission End Date | 2025-03-24 04:30 AM |
| Clarification start Date | Clarification End Date | ||
| Bid Validity Period (in Days) | 180 |
- ePublished Date 2025-03-05 12:30 PM
- Bid Opening Date2025-03-25 05:00 AM
- Document Download Start Date2025-03-05 12:30 PM
- Document Download End Date2025-03-24 04:30 AM
- Clarification End Date
- Clarification End Date
- Bid Submission Start Date2025-03-05 12:30 PM
- Bid Validity Period (in Days)180
Cost Specification
| Tender Fee | ₹ 100 |
| EMD (Earnest Money Deposit) | ₹ 2,13,65,000 |
| EMD Fee Type | Fixed |
| Payment Instruments/Mode | Offline |
Tender Description
Work Description - Backend Design,physical Ip,fabrication,packaging And Supply Of Multi-processor System On Chips
The Department of Defence Research and Development (DRDO), under the authority of Aravind Kumar Pathak at RCI, DCMM, Hyderabad, invites open tenders (Tender ID: 2025_DRDO_700325_1, Reference Number: RCI/25ATT144/CMS-II) for the Backend Design, Physical IP, Fabrication, Packaging, and Supply of a Multi-Processor System on Chips. Interested parties can download tender documents from March 5th, 2025, 6:00 PM to March 24th, 2025, 10:00 AM. Bid submission opens on March 5th, 2025, 6:00 PM and closes on March 24th, 2025, 10:00 AM, with bid opening scheduled for March 25th, 2025, 10:30 AM at the Conference Hall, DCMM, RCI, Hyderabad. A fixed EMD of ₹2,13,65,000 is required, payable to THE DIRECTOR at RCI, Hyderabad. A tender fee of ₹100 is payable to THE DIRECTOR at RCI, Hyderabad; exemption is allowed. The contract is for supply of goods, with a 300-day work period and 180-day bid validity. Detailed specifications are available in the tender documents.
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Tender Contact Details
| Office Inviting Bids | Aravind Kumar Pathak |
| Address | Rci,dcmm,hyderabad |
| Contact Details | NA |
| NA | |
| Website | NA |
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